As the release date approaches, there will be more and more news about the iPhone7. There are rumors that the iPhone7 motherboard has no big change compared to the iPhone 6s. This also confirms that the appearance of the iPhone 7 has not changed much from the side; however, there are many changes in the design of the components, the most obvious is that the A10 processor changes. The A10 processor has become larger, which may have a good effect on heat dissipation. The iPhone7 motherboard will use EMI electromagnetic shielding technology, which makes the layout of internal components more compact, bringing the possibility that the iPhone7 will become thinner.
Compared with the iPhone6s, the iPhone7 has a longer handset. Compared with the iPhone6 â€‹â€‹series, the iPhone7 still has no ultra-narrow bezel design from the engineering machine. This also leads to the iPhone7 screen still not high, because there is no more accurate data. Therefore, it is not certain whether the previously exposed 4.7-inch iPhone7 Home button cannot be pressed. In addition, the design of the headphone jack and signal overflow port is exactly the same as before.
Exposure iPhone7 detailed parameters
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